Ventec

Ventec has a wide range of products servicing the prepreg and copper clad laminate markets. Including a full range of polyimide products, which encompasses prepregs for hole filling, (with low-flow and no-flow options) as well as standard Tg dicy-cured epoxy, we are constantly upgrading and developing our range. In its Suzhou facility, Ventec Electronics manufactures a very wide range of thin laminates and prepregs. These include high-reliability phenolic-cured epoxy, high-reliability halogen-free, with low-Dk halogen-free in development, low-Dk epoxy, with lower-Dk in development. Core thicknesses of 0.0020" fall within standard capability, with copper foils in thicknesses down to 5 micron. tec-speed ® Standard FR4 Material Lead Free Assembly Halogen Free Thermal Management Polyimide Signal Integrity / tec-speed Flex-Rigid & Heat Sink Bonding Special Applications